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Of course, that is not enough. Even TSMC Arizona Fab 21 with TSMC N4P this year only produces approximately 10k wafers per month. You expect Arizona Fab 52 this year to have higher volume than Fab 21, which sounds like a daydream. For the most optimistic estimate, 2025 Dec will have the EEP model of Panther Lake laptop shipping, and Intel will recall this as a success, and when you focus on the Intel 18a with CPU tile, the die size will lie at ~70 mm^2... for next year, Nova Lake will not come until the Intel 18a can mass production with ~120mm^2 die, or they can do it easier with external manufacture (TSMC N2P)... |
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发表于 2025-4-19 12:35
