前见： https://www.chiphell.com/thread-2493081-1-1.html
来源： Uniko's Hardware
Community Announcement – ROG MAXIMUS Z690 FORMULA OWNERS service announcement.
The ROG Maximus Formula line of motherboards has a unique feature: if you run a liquid cooling loop in your system, you can include the motherboard’s CrossChill III VRM water block in your loop as an alternative to using it as an air-cooled heatsink. However, a problem has been identified on some ROG Maximus Z690 Formula motherboards — read on to see if you may have been affected, and how ASUS is dedicated to fixing the issue.
Developed in partnership with EK, the CrossChill VRM thermal solution on the ROG Maximus Z690 Formula uses a new electroless nickel plating. In certain configurations, this plating can break down, leading to galvanic corrosion inside the block’s water channel. At present, this issue only affects the Maximus Z690 Formula.
If you’ve been affected by this issue, we recommend ceasing use of the Maximus Z690 Formula’s CrossChill III VRM solution and contacting ASUS customer support for your region. We’re doing everything we can to look after our loyal customers, so we’re currently offering a choice of two solutions to affected users: either you can return the board for a full refund or a replacement.
ROG is committed to our customers. If you currently use or plan on using the ROG Maximus Z690 Formula’s CrossChill VRM block in a liquid cooling loop, contact our support team and we’ll take care of you.
Our North America service team has been informed and ready to support you if you have been affected. Please us the links below. If outside of North America please visit the support and support website for ASUS in your region.If you have any questions please do not hesitate to reach out to our service team.
If you are running the MAXIMUS Z690 FORMULA EK CROSSCHILL III VRM heatsink/block passive (not part of a liquid cooling loop) it will not be affected or compromise the VRM thermal performance.
DeepL机翻：
社区公告 - ROG MAXIMUS Z690 FORMULA用户服务公告
ROG Maximus Formula系列主板有一个独特的功能：如果您在系统中运行液体冷却回路，您可以将主板的CrossChill III VRM水阻块纳入您的回路中，以替代将其用作空气冷却散热器。然而，在一些ROG Maximus Z690 Formula主板上发现了一个问题--继续阅读，看看你是否可能受到影响，以及华硕是如何致力于解决这个问题的。
与EK公司合作开发的ROG Maximus Z690 Formula上的CrossChill VRM散热解决方案采用了新的无电解镍镀层。在某些配置中，这种镀层可能会破裂，导致块状水路内的电化学腐蚀。目前，这个问题只影响到Maximus Z690 Formula。
如果你受到这个问题的影响，我们建议停止使用Maximus Z690 Formula的CrossChill III VRM解决方案，并联系你所在地区的华硕客户支持。我们正在尽一切努力照顾我们的忠实客户，所以我们目前为受影响的用户提供了两种解决方案的选择：要么你可以退回板子以获得全额退款，要么更换。
ROG对我们的客户是有承诺的。如果你目前使用或计划在液体冷却回路中使用ROG Maximus Z690 Formula的CrossChill VRM块，请联系我们的支持团队，我们将为你提供帮助。
我们的北美服务团队已经得到通知，如果你受到影响，随时可以为你提供支持。请使用下面的链接。如果在北美以外的地区，请访问您所在地区的华硕支持和支援网站。如果您有任何问题，请不要犹豫，与我们的服务团队联系。
如果你正在使用MAXIMUS Z690 FORMULA EK CROSSCHILL III VRM散热器/块被动式（不是液体冷却回路的一部分），它将不会受到影响或损害VRM的散热性能。 |
310112100042806
发表于 2023-2-20 09:50
