That's a sea of wires. We use fan out, we're for level fan out in order to connect the two dies. So you get the lower latency, the lower power, it's stateless. So we're able to just connect the data fabric through that connect interface into the CCD. So the first big change between a Granite or a 9950X3D and this the Strix Halo always the die to die interconnect. Low power, same high bandwidth, 32 bytes per cycle in both directions, lower latency. So everything that and almost instant on and off stateless because it's just a sea of wires going across. So it's a little [bit of a tradeoff] of course, the fabrication technology is more expensive than the one over there [points to a 9950X3D], but it meets the needs of the customer and the fact that it has to be a low power that can actually connect.
https://chipsandcheese.com/p/amds-strix-halo-under-the-hood
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发表于 2025-1-20 10:30
